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Compaq Evo D500 User Manual

Compaq Evo D500
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Chapter 2 System Overview
2.4.1 PROCESSORS
The Compaq Deskpro EN Series include models based on Celeron and Pentium III processors. All
Compaq Deskpro Workstation AP230 models feature the Pentium III processor. These processors
are backward-compatible with software written for the Pentium II, Pentium MMX, Pentium Pro,
Pentium, and x86 microprocessors. Both processor architectures include a floating-point unit, first
and secondary caches, and enhanced performance for multimedia applications through the use of
multimedia extension (MMX) instructions.
These systems employ a PGA370 zero-insertion-force (ZIF) socket designed for mounting a
“Flip-Chip” (FC-PGA370) processor package (Figure 2-10).
FC-PGA Package
Heat Sink fo
r
MHz Processors
Heat Sink
Retaining Bar
Heat Sink for
GHz Processors
(two types)
Lock/Unlock
Handle
(Shown in unlock position)
Heat Sink
Retaining Clip
PGA370
Socket
FC-PGA2 Package
w/ Integrated Heat
Spreader
Figure 2–10. Processor Assembly And Mounting
These systems support processors fitted with passive heat sinks or processors fitted with heat
sink/fan assembly with a power cable that attaches to a fan-power header provided on the system
board. There are three types of passive heat sinks. The MHz processors use a heat sink that clips
directly on the FC-PGA package. The GHz processors use two heat sink types; one for attaching
directly to the die of the FC-PGA package and one for accommodating the Integrated Heat
Spreader (IHS) used on the FC-PGA2 package.
NOTE: The three types of heat sinks are not interchangeable. Also, these systems
support processors using the FC-PGA or FC-PGA2 package only. The PPGA370
package, while physically installable, will not work in these systems.
Compaq Deskpro and Evo Personal Computers
Featuring Intel Celeron and Pentium III Processors
Fifth Edition – March 2002
2-14

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Compaq Evo D500 Specifications

General IconGeneral
BrandCompaq
ModelEvo D500
CategoryDesktop
LanguageEnglish

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