Enclustra Mars ZX3 - Heat Dissipation; Clock Generation; Power Consumption - Reference Values; Module Clock Resources

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VCC_MOD (5 V) 950 mW 1300 mW 1565 mW
VCC_3V3 76 mW 116 mW 142 mW
VCC_IO (2.5 V) 17 mW 165 mW 200 mW
Total 1043 mW 1581 mW 1907 mW
Table 15: Power Consumption - Reference Values
2.10.6 Heat Dissipation
High performance devices like the Xilinx Zynq-7000 SoC need cooling in most applications; always make
sure the SoC is adequately cooled.
Information that may assist in selecting a suitable heat sink for the Mars ZX3 SoC module can be found in
the Enclustra Modules Heat Sink Application Note [17].
For Enclustra Mars modules an Enclustra heat sink is available for purchase along with the product. It
represents an optimal solution to cool the Mars ZX3 SoC module- it is low profile (less than 7 mm tall) and
covers the whole module surface. It comes with a gap pad for the SoC device and four screws to attach it
to the module PCB. With additional user configured gap pads, it is possible to cool other components on
board as well. For details, please refer to the Enclustra website.
Warning!
Depending on the user application, the Mars ZX3 SoC module may consume more power than can
be dissipated without additional cooling measures; always make sure the SoC is adequately cooled by
installing a heat sink and/or providing air flow.
2.11 Clock Generation
A 33.33 MHz oscillator is used for the Mars ZX3 SoC module clock generation. The 33.33 MHz clock is fed
to the PS and to the FPGA logic. Table 16 describes the clock connections.
Signal Name Frequency Package Pin SoC Pin Type
CLK33 33.33 MHz F7 PS_CLK
CLK33 33.33 MHz Y6 IO_L13P_T2_MRCC_13
Table 16: Module Clock Resources
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