2.11.4 Voltage Supply Outputs
Table 16 presents the supply voltages generated on the Mercury+ XU6 SoC module, that are available on
the module connector.
Pin Name Module Connector Pins Voltage Maximum Comment
Current
9
VCC_3V3
A-26, 29, 50, 86
3.3 V ±5%
4 A (and max
Always active
B-55, 79, 115, 127, 152, 155 0.3 A per pin)
C-96, 103, 136, 143
VCC_2V5 A-53, 62, 65, 89 2.5 V ±5% 0.25 A Controlled by PWR_EN
VCC_1V8
B-52, 76, 108, 128
1.8 V ±5% 1 A Controlled by PWR_EN
C-83, 123, 165
Table 16: Voltage Supply Outputs
Warning!
Do not connect any power supply to the voltage supply outputs nor short circuit them to GND, as this
may damage the Mercury+ XU6 SoC module.
2.11.5 Power Consumption
Please note that the power consumption of any MPSoC device strongly depends on the application (on the
configured bitstream and I/O activity).
To estimate the power consumption of your design, please use the Xilinx Power Estimator available on the
Xilinx website.
2.11.6 Heat Dissipation
High performance devices like the Xilinx Zynq Ultrascale+ MPSoC need cooling in most applications; always
make sure the MPSoC is adequately cooled.
For Mercury modules an Enclustra heat sink kit is available for purchase along with the product. It repre-
sents an optimal solution to cool the Mercury+ XU6 SoC module - the heat sink body is low profile and
usually covers the whole module surface. The kit comes with a gap pad for the MPSoC device, a fan and
required mounting material to attach the heat sink to the module PCB and baseboard PCB. With additional
user configured gap pads, it is possible to cool other components on board as well.
Alternatively, if the Enclustra heat sink does not match the application requirements, a third-party heat sink
body (ATS) and an additional gap pad (t-Global) may be used. Please note that the Enclustra heat sink kit
already contains all necessary items for cooling the module (heat sink body, gap pad, fan, mounting mate-
rial).
Table 17 lists the heat sink and thermal pad part numbers that are compatible with the Mercury+ XU6 SoC
module. Details on the Mercury heatsink kit can be found in the Mercury Heatsink Application Note [17].
9
The maximum available output current depends on your design. See sections 2.11.1 and 2.11.5 for details.
D-0000-464-001 31 / 58 Version 02, 21.07.2021
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