Product Name Package Name Enclustra ATS t-Global
Heat Sink Heat Sink Thermal Pad
Mercury+ XU6 SFVC784 [23] ACC-HS3-Set ATS-52230G-C1-R0 TG-A6200-25-25-1
Table 17: Heat Sink Type
An Enclustra heatsink for the Mercury+ XU6 SoC module covering the entire module surface is currently un-
der development. Until this part is available, the ACC-HS3-Set heatsink kit may be used as an intermediate
solution for prototyping purposes.
Please note that the adhesive heat sink part is recommended only for prototyping purposes. In cases where
the module is used in environments subject to vibrations, additional mechanical fixation is recommended.
Warning!
Depending on the user application, the Mercury+ XU6 SoC module may consume more power than
can be dissipated without additional cooling measures; always make sure the MPSoC is adequately
cooled by installing a heat sink and/or providing air flow.
2.11.7 Voltage Monitoring
Several pins on the module connector on the Mercury+ XU6 SoC module are marked as VMON. These
are voltage monitoring outputs that are used in the production test for measuring some of the on-board
voltages.
It is not allowed to draw power from the voltage monitoring outputs.
Table 18 presents the VMON pins on the Mercury+ XU6 SoC module.
Pin Name Mod. Conn. Pin Connection Description
VMON_5V0 A-102 VCC_5V0 ×
2
5
5 V on-board voltage
(assembly option VCC_INT)
VMON_VTT B-8 VCC_VTT VTT on-board voltage
VMON_0V9 B-167 VCC_0V9 0.9 V on-board voltage
(assembly option VCC_0V85)
VMON_1V2 B-168 VCC_1V2 1.2 V on-board voltage
(assembly option VCC_PSINT)
VMON_BAT_FPGA C-8 NC not connected
(assembly option VCC_BAT_FPGA)
Table 18: Voltage Monitoring Outputs
D-0000-464-001 32 / 58 Version 02, 21.07.2021
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