Fujitsu PRIMERGY TX100 S2 Service Supplement

TX100 S2 Service Supplement 103
Replacement routines
Ê Reinstall all remaining system board components as shown in the related
sections:
– Heat sinks: see section "Installing the processor heat sink" on page 94
– Memory modules: refer to the PRIMERGY TX100 S2 Options Guide
– Expansion cards: refer to the PRIMERGY TX100 S2 Operating Manual
and Options Guide
I Install all expansion cards into their original slots.
– UFM: see section "Replacing the USB Flash Module (UFM)" on
page 109
– TPM: see section "Replacing the Trusted Platform Module (TPM)" on
page 104.
Ê Reconnect all cables to the system board.
I Ensure to connect SATA cables in the right order (see the cabling
plans in the appendix of the PRIMERGY TX100 S2 Options Guide).
The boot HDD should always be connected to SATA connector
HDD0.
Ê Reinstall the air duct as described in section 4.1.4.2 on page 37.
Ê Close the HDD cage as described in section 4.1.2.2 on page 27.
Ê Close the side cover as described in section 4.1.1.2 on page 24 and
reconnect the AC power cord.
Ê Reconnect all external cables.
Ê If applicable, activate TPM functionality in the system BIOS under Security >
TPM (Security Chip) Setting > Security Chip. For more information, refer to the
"D2779 BIOS Setup Utility for PRIMERGY TX100 S2" manual.
V CAUTION!
After installing the new system board, it is necessary to update system
specific data (e. g. BIOS) to ensure proper operation. Please refer to the
BIOS Manual for a detailed description.

Fujitsu PRIMERGY TX100 S2 Specifications

General

Tcase	72.7 °C
Bus type	DMI
Stepping	B1
FSB Parity	No
Processor code	SLBLJ
Processor cache	8 MB
Processor cores	4
Processor model	X3430
System bus rate	2.5 GT/s
Processor series	Intel Xeon 3400 Series
Processor socket	LGA 1156 (Socket H)
Processor codename	Lynnfield
Motherboard chipset	Intel® 3420
Processing Die size	296 mm²
Processor frequency	2.4 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	- MHz
Processor boost frequency	2.8 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	1x16, 2x8, 4x4
Supported instruction sets	SSE4.2
Thermal Design Power (TDP)	95 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	18
Physical Address Extension (PAE)	36 bit
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3-SDRAM
Number of Processing Die Transistors	774 M
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	800, 1066, 1333 MHz
Memory bandwidth supported by processor (max)	21 GB/s
Maximum internal memory supported by processor	32 GB
HDD size	3.5 \
HDD interface	Serial ATA
Optical drive type	DVD-RW
Total storage capacity	1000 GB
Maximum storage capacity	4 TB
Number of HDDs installed	2
Memory slots	4x DIMM
Internal memory	4 GB
Memory clock speed	1333 MHz
Maximum internal memory	16 GB
Memory layout (slots x size)	2 x 2 GB
Maximum graphics card memory	64 MB
Graphics card	ES1000
LAN controller	Intel® 82578DM
Networking features	Gigabyte Ethernet
PS/2 ports quantity	0
USB 2.0 ports quantity	11
PCI Express slots version	2.0
Power supply	250 W
Power requirements	100 - 127 V, 200 - 240 V, 47 - 63 Hz
Power consumption (typical)	171 W
Noise level	24 dB
Operating system installed	-
Compatible operating systems	Windows Server 2008, Server 2003 Novell SUSE Linux Enterprise Server Red Hat Enterprise Linux
Operating temperature (T-T)	10 - 35 °C
Operating relative humidity (H-H)	10 - 85 %
Sustainability certificates	ENERGY STAR
Certification	GS CE CSAc/us ULc/us FCC CB RoHS WEEE
Chassis type	Tower
Processor ARK ID	42927
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Depth	386 mm
Width	203 mm
Height	390 mm
Weight	12000 g