SO
2
0.2
H
2
S 0.006
NH
3
0.05
Cl
2
0.01
EMI
All electromagnetic interference (EMI) sources, from outside or inside of the switch and application
system, adversely affect the switch in the following ways:
• A conduction pattern of capacitance coupling.
• Inductance coupling.
• Electromagnetic wave radiation.
• Common impedance (including the grounding system) coupling.
To prevent EMI, use the following guidelines:
• If AC power is used, use a single-phase three-wire power receptacle with protection earth (PE) to
filter interference from the power grid.
• Keep the switch far away from radio transmitting stations, radar stations, and high-frequency
devices to make sure the EMI levels do not exceed the compliant range.
• Use electromagnetic shielding when necessary. For example, use shielded interface cables.
• To prevent signal ports from getting damaged by over-voltage or over-current caused by lightning
strikes, only route interface cables indoors.
Grounding
Using a good grounding system to protect your switch against lightning shocks, interferences, and ESD
is essential to the operating reliability of your switch.
Make sure the resistance between the chassis and the ground is less than 1 ohm.
Power
Perform the following tasks to meet the power requirements:
1. Calculate the system power consumption.
The system power consumption varies by card type and density. For more information about
system power consumption calculation, see "Appendix A Chassis views and tec
hnical
specifications."
2. Select power supplies and identity the number of power supplies.
The total maximum output power of all power supplies must be higher than the system power
consumption. For more information about available power supplies, see "Appendix B FRUs and
compatibility matrixes."
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