HP 280 G3 User Manual

Number of long beeps/blinks Error category
4 Thermal
5 System board
Patterns of blink/beep codes are determined by using the following parameters:
●
1 second pause occurs after the last major blink.
●
2 second pause occurs after the last minor blink.
●
Beep error code sequences occur for the rst 5 iterations of the pattern and then stop.
●
Blink error code sequences continue until the computer is unplugged or the power button is pressed.
NOTE: Not all diagnostic lights and audible codes are available on all models.
The red LED blinks to represent the major error category (long blinks). The white LED blinks to represent the
minor error category (short blinks). For example, ‘3.5’ indicates 3 long red blinks and 5 short white blinks to
communicate the processor is not detected.
Category Major/minor code Description
BIOS 2.2 The main area (DXE) of BIOS has become corrupted and there is no recovery
binary image available.
2.3 The embedded controller policy requires the user to enter a key sequence.
2.4 The embedded controller is checking or recovering the boot block.
Hardware 3.2 The embedded controller has timed out waiting for BIOS to return from
memory initialization.
3.3 The embedded controller has timed out waiting for BIOS to return from
graphics initialization.
3.4 The system board displays a power failure (crowbar).*
3.5 The processor is not detected.*
3.6 The processor does not support an enabled feature.
Thermal 4.2 A processor over temperature condition has been detected.*
4.3 An ambient temperature over temperature condition has been detected.
4.4 An MXM over temperature condition has been detected.
System board 5.2 The embedded controller cannot nd valid rmware.
5.3 The embedded controller has timed out waiting for the BIOS.
5.4 The embedded controller has timed out waiting for BIOS to return from
system board initialization.
5.5 The embedded controller rebooted the system after a possible lockup
condition had been detected through the use of a System Health Timer,
Automated System Recovery Timer, or other mechanism.
* Indicates hardware triggered event; all other events are controlled by the BIOS.
82 Chapter 7 POST error messages and diagnostic front panel LEDs and audible codes

HP 280 G3 Specifications

General

Memory slots	2x DIMM
Internal memory	8 GB
Memory clock speed	2666 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	32 GB
Tjunction	100 °C
Processor cache	9 MB
Processor cores	6
System bus rate	8 GT/s
Processor family	Intel® Core™ i5
Processor socket	LGA 1151 (Socket H4)
Processor frequency	3 GHz
Processor cache type	Smart Cache
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	4.4 GHz
Processor operating modes	64-bit
PCI Express configurations	1x8+2x4, 1x16, 2x8
Thermal Design Power (TDP)	65 W
Number of processors installed	1
Maximum number of PCI Express lanes	16
Memory bandwidth supported by processor (max)	41.6 GB/s
Maximum internal memory supported by processor	128 GB
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Total HDDs capacity	1000 GB
Card reader integrated	-
On-board graphics card	Yes
On-board graphics card ID	0x3E92
On-board graphics card model	Intel® UHD Graphics 630
Maximum on-board graphics card memory	64 GB
On-board graphics card OpenGL version	4.5
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1100 MHz
Number of displays supported (on-board graphics)	3
Microphone in	No
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	2
USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity	0
Chassis type	SFF
Product color	Black
Placement supported	Horizontal/Vertical
Product type	PC
Motherboard chipset	Intel® H370
HP segment	Business
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Power supply	180 W
Scalability	1S
Processor ARK ID	134895
Processor package size	37.5 x 37.5 mm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Thermal solution specification	PCG 2015C

Weight and Dimensions

Depth	296 mm
Width	95 mm
Height	270 mm
Weight	4200 g