IEI also provides two thermal solutions for customers to choose.
IEI has developed a highly efficient thermal solution for the 3.5" motherboard - IEI Heat
Conduction Casing (IHCC). With its well-design structure, the IHCC can effectively improve
heat transfer performance and cut time-to-market. It completely joints with the heat
spreader for better CPU heat transfer in 0ºC–60ºC operating temperature using active
cooling (P/N: 19XM0B619-0002001-000-RS, see Figure 4-5), and in 0ºC–45ºC operating
temperature using passive cooling (P/N:19XM0B619-0002002-000-RS, see Figure 4-6).
Figure 4-5: Active Cooling
Figure 4-6: Passive Cooling
4.5.1 Motherboard Installation
IEI recommend you to choose the DRPC-W-JL for the WAFER-JL-N5105 installation. The
DRPC-W-JL is a compact embedded chassis designed for 3.5" single board computers.
With its two-dimensional heat conduction and low wind resistance design on the surfaced,
no extra thermal solution is needed to form the heat dissipation part. Users can get higher
hardness, and benefit from the reduced production cost resulting from shortening
manufacturing time. Furthermore, the height of aluminum extrusion can therefore be
downsized to make the product light weight.
Figure 4-7: DRPC-W-JL-R10
Figure 4-8: DRPC-W-JL-R10 with Extra Fan Cooling
To Next Page
Loading...
Need help?
General