A - 2 ET1 Enterprise Tablet Integrator Guide
Audio Stereo speakers, microphone and mono headset connector (2.5 mm jack
with microphone).
Performance Characteristics
CPU Texas Instruments OMAP 4430 @ 1 GHz
Operating System Android-based ASOP 2.3
Memory 1 GB RAM/4 GB Flash plus 4 GB microSD card. User accessible microSD
card slot supports up to 32 GB.
Interface/Communications USB 1.1 Full-speed
Output Power USB (Docking Connector): 5 VDC @ 500 mA max.
USB (Expansion Module): 5 VDC @ 500 mA max.
User Environment
Operating Temperature 0°C to 50°C (32°F to 122°F)
Storage Temperature -40°C to 70°C (-40°F to 158°F)
Charging Temperature 0° C to 40° C (32°F to 104°F)
Humidity 10% to 95% RH non-condensing
Drop Specification Multiple 1.2 m (4 ft.) drops per MIL-STD 810G specifications.
Tumble 1000 0.5 m (1.6 ft.) tumbles (2000 drops) per IEC tumble specifications
Electrostatic Discharge (ESD) +/-15kVdc air discharge, +/-8kVdc direct discharge, +/-8kVdc indirect
discharge
Sealing IP54
Wireless LAN Data and Voice Communications
Wireless Local Area Network
(WLAN) radio
IEEE
®
802.11a/b/g/n with internal antenna
Data Rates Supported 1, 2, 5.5, 6, 9, 11, 12, 18, 24, 36, 48, and 54 Mbps
Note that 802.11n data rates may be higher.
Operating Channels Chan 36-165 (5180 – 5825 MHz), Chan 1-13 (2412-2472 MHz); actual
operating channels/frequencies depend on regulatory rules and
certification agency
Security Security Modes: Legacy, WPA and WPA2
Encryption: WEP (40 and 128 bit), TKIP and AES
Authentication: TLS, TTLS (MS-CHAP), TTLS (MS-CHAP v2), TTLS
(CHAP), TTLS (PAP), PEAP-TLS, PEAP (MS-CHAP v2), EAP -FAST-TLS,
EAP-FAST (MS-CHAP v2).
Spreading Technique Direct Sequence Spread Spectrum (DSSS) and Orthogonal Frequency
Division Multiplexing (OFDM)
Table A-1
ET1 Technical Specifications (Continued)
Item Description
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