Table of Contents
Baseband description............................................................................................................................................9–7
System module block diagram........................................................................................................................9–7
Baseband functional description.....................................................................................................................9–7
Absolute maximum ratings............................................................................................................................9–10
Phone modes of operation.............................................................................................................................9–10
Power distribution..........................................................................................................................................9–12
Clocking scheme..............................................................................................................................................9–13
Bluetooth/FM module.....................................................................................................................................9–14
USB....................................................................................................................................................................9–15
SIM interface....................................................................................................................................................9–16
RS MMC interface.............................................................................................................................................9–16
Battery interface..............................................................................................................................................9–17
Camera interface.............................................................................................................................................9–18
Camera interface........................................................................................................................................9–18
Camera construction..................................................................................................................................9–18
Back camera slider detection switch.......................................................................................................9–20
Flash LED.....................................................................................................................................................9–20
User interface..................................................................................................................................................9–22
Display interface.........................................................................................................................................9–22
Keyboard.....................................................................................................................................................9–23
Display and keyboard backlight...............................................................................................................9–24
ALS interface...............................................................................................................................................9–25
ASICs.................................................................................................................................................................9–26
RAP ASIC.......................................................................................................................................................9–26
EM ASIC N2200............................................................................................................................................9–26
EM ASIC N2300............................................................................................................................................9–27
Device memories.............................................................................................................................................9–27
RAP memories NOR flash and SDRAM.......................................................................................................9–27
Combo memory..........................................................................................................................................9–27
Audio concept.......................................................................................................................................................9–28
Audio HW architecture....................................................................................................................................9–28
Internal microphone.......................................................................................................................................9–29
External microphone.......................................................................................................................................9–29
Internal earpiece.............................................................................................................................................9–30
Internal speaker..............................................................................................................................................9–30
External earpiece.............................................................................................................................................9–31
Vibra circuitry..................................................................................................................................................9–31
Pop-portTM connector....................................................................................................................................9–32
Baseband technical specifications......................................................................................................................9–33
External interfaces..........................................................................................................................................9–33
External interfaces.....................................................................................................................................9–33
ACI interface electrical characteristics.....................................................................................................9–33
VOUT electrical characteristics..................................................................................................................9–34
USB IF electrical characteristics................................................................................................................9–34
FBUS interface electrical characteristics (between RAP and N2300)....................................................9–35
Headset hook detection interface (XMICN) electrical characteristics....................................................9–35
Audio signal electrical characteristics......................................................................................................9–36
SIM IF connections......................................................................................................................................9–36
RS MMC interface connections...................................................................................................................9–36
Charger connector and charging interface connections & electrical characteristics..........................9–37
RM-180
System Module Nokia Customer Care
Issue 1 COMPANY CONFIDENTIAL Page 9 –3
Copyright © 2006 Nokia. All rights reserved.
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