Nokia N72

Figure 88 Application processor high level block diagram
Section Description
Application processor also called an application ASIC because it is
processing application SW and handles the UI SW.
It consists of OMAP3.3 and peripheral subsystems
like camera, display and keyboard driver blocks.
OMAP3.3 consists of ARM926 (MPU subsystem), TMS320C55x
(DSP subsystem), DMA and OMAP3.3s internal
peripherals.
Helen3 (OMAP1710) MPU subsystem based on an ARM926EJ. MPU is able to perform most
of the application operations on the chip.
System DMA component mainly used to help the MPU and DSP perform data
memory transfer-specific tasks, leaving more
available MIPS for both processors.
DSP subsystem based on a TMS320C55x™ DSP core, which is
responsible for intensive data computing tasks like
real-time audio and video handling on application
side, e.g. voice recording.
Internal memory subsystem composed of a single port SRAM.
Secure modules Application processor contains a set of several
components, including ROM, a single port SRAM, and
eFUSE cells. These components enable the system to
support secure applications.
Memory interfaces The memory interfaces define the system memory
access organization of application processor.
RM-180
System Module Nokia Customer Care
Issue 1 COMPANY CONFIDENTIAL Page 9 –9
Copyright © 2006 Nokia. All rights reserved.