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General| Memory Support | LPDDR4, DDR4 |
|---|---|
| Max RAM | 8 GB |
| Package | FCBGA |
| CPU Architecture | ARM Cortex-A72, ARM Cortex-A53 |
| Number of Cores | 8 |
| GPU | GC7000UL |
| Storage Interfaces | eMMC 5.1, SD Card, SATA 3.0 |
| Video Output | HDMI, MIPI DSI |
| Connectivity | Ethernet, USB, I2C, SPI, UART |
| Operating Temperature | -40°C to 105°C |
| Security | Secure Boot |
| Camera Interfaces | MIPI CSI |
| Video Decoding | H.265, H.264, VP9 |
| Video Encoding | H.265, H.264 |
Lists the i.MX8 QM and i.MX8 QXP processors supported by this guide.
Guide companion to chip reference manuals and data sheets.
Lists additional reading for architecture background and high-speed board design.
Information on where to find NXP documentation.
Explains notational conventions used throughout the document.
Defines acronyms and abbreviations used in the document.
Introduces the tables containing recommendations for optimal design.
Introduces recommendations for layout and routing of i.MX8 QM and QXP.
General recommendations for using design tools and creating footprints.
Guidelines for placing decoupling capacitors for optimal performance.
Recommendations for PCB stack-up design for i.MX8 QM.
Recommends a 12-layer PCB stack-up for i.MX8 QM for power routing.
Recommends an 8-layer PCB stack-up for i.MX8 QXP for power routing.
Recommendations for DDR layout and routing.
Explains DDR3L/LPDDR4 connectivity and ball naming.
Lists trace lengths and delays for i.MX8 QM DDR package.
Lists trace lengths and delays for i.MX8 QXP DDR package.
Guides for performing trace length matching for LPDDR4/DDR3L.
Generic guidelines for implementing i.MX8 with LPDDR4.
Routing recommendations for i.MX8 QM LPDDR4-3200.
Routing recommendations for i.MX8 QXP LPDDR4-2400.
Generic guidelines for implementing i.MX8 QXP with DDR3L.
Guide for performing DRAM SI simulations.
General recommendations for routing high-speed signals.
States design engineer's responsibility and document scope.
Recommendations for setting trace impedances and widths.
Describes the reset architecture and routing for development purposes.
Guidelines for 24 MHz oscillator tolerance and 32.768 kHz clock options.
Provides 24 MHz oscillator tolerance guidelines for various interfaces.
Discusses using crystals or external clocks for 32.768 kHz input.
Explains internal load capacitor trimming for crystal oscillators.
Discusses delivering clean and reliable power to i.MX8 internal rails.
Shows block diagrams of power trees for i.MX8 QM and QXP development platforms.
Outlines steps for designing a good Power Delivery Network (PDN).
Guidance on routing the VDD_MAIN power supply for i.MX8 QM.
Describes USB connectivity for i.MX8QM/QXP.
Recommendations for routing USB signals.
Details USB VBUS and ID pin voltage limits.
Considerations for implementing USB Type-C connectors.
Describes HDMI/Display Port connectivity for i.MX8 QM.
Power saving/design optimization guidance.
Guidance for unused power supply rails and signal contacts for i.MX8 QM.
Guidance for unused power supply rails for i.MX8 QXP.
Recommendations for unused signal strapping for i.MX8 QXP.
Discusses strategies for allocating and using GPIO pins.
Covers allocating GPIOs to software systems and interfaces.
Guidance on planning GPIO voltage supplies and grouping them.
Recommendations for facilitating debug, especially for SCU UART.
Introduces thermal considerations and design factors for thermal management.
Explains how PCB dimensions impact heat dissipation capability.
Discusses increasing copper volume for better heat dissipation.
Importance of PCB material selection for thermal properties and CTE.
Strategies for reducing thermal resistance for good thermal performance.
Using heat spreaders with TIM to reduce thermal resistance.
Using thermal vias to create low-thermal-impedance paths.
Strategies for designing power nets to reduce ohmic losses and heat.
Recommendations for component placement to optimize heat transfer.
How PCB surroundings influence heat transfer efficiency.
Considerations for airflow and air mover placement for convection.
Design considerations for adding heatsinks for heat dissipation.
Essential for validating thermal design.
Reduces need for active cooling.
Summary of thermal design steps.
Introduces techniques for detecting and preventing board issues.
Techniques to avoid damage from excessive current during board bring-up.
Steps to validate supply voltages and avoid incorrect voltage pitfalls.
Essential for system function.
Essential for system boot.
Practical checklist for bring-up.
Describes how BSDL files define scan chains for testing connectivity.
Details how to enter boundary scan mode using specific pins.
Discusses I/O power supply activity for boundary scan mode.
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