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NXP Semiconductors i.MX8 QM User Manual
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i.MX8 QM / i.MX8 QXP Hardware Developer’s
Guide
NXP Semiconductors
Document identifier: IMX8HWDG
User's Guide
Rev. 2.4p, 06/2021
2
Table of Contents
Contents
2
1 Overview
3
1.1 Devices supported
3
1.2 Essential reference
3
1.3 Suggested reading
3
1.3.1 General information
3
1.4 Related documentation
4
1.5 Conventions
4
1.6 Acronyms and abbreviations
4
2 i.MX8 QM and QXP design checklist
7
2.1 Design checklist tables
7
2.2 JTAG signal termination
18
3 i.MX8 layout/routing recommendations
19
3.1 Introduction
19
3.2 Basic design recommendations
19
3.2.1 Placing decoupling capacitors
19
3.3 Stack-up recommendations
19
3.3.1 Stack-up recommendation (i.MX8 QM)
20
3.3.2 Stack-up recommendation (i.MX8 QXP)
20
3.4 DDR layout routing recommendations
21
3.4.1 DDR pin naming
21
3.4.2 i.MX8 QM DDR package conductor lengths
23
3.4.3 i.MX8 QXP DDR package conductor lengths
27
3.4.4 Length matching guides
30
3.4.5 LPDDR4-2400/3200 design recommendations
32
3.4.6 i.MX8 QM LPDDR4-3200 routing recommendations
33
3.4.7 i.MX8 QXP LPDDR4-2400 routing recommendations
36
3.4.8 i.MX8 QXP general DDR3L-1866 routing recommendations
39
3.4.9 i.MX8 QXP DDR3L-1866 routing recommendations
40
3.4.10 NXP i.MX8 QXP DDR3L-1866 validation board
41
3.4.11 DRAM SI simulation guide
48
3.4.12 JEDEC specification compliance
49
3.5 High-speed routing recommendations
50
3.6 Disclaimers
50
3.7 Trace impedance recommendations
51
3.8 Reset architecture/routing
52
3.9 Clock crystal considerations
53
3.9.1 Oscillator tolerance (24 MHz)
53
3.9.2 Clock options (32.768 kHz)
53
3.9.3 Internal load capacitor trimming (24 MHz and 32.768 kHz)
54
3.10 Power connectivity/routing
56
3.10.1 i.MX8 QM/QXP power distribution block diagram
57
3.10.2 Power routing/distribution requirements
59
3.11 VDD_MAIN routing guidance (i.MX8 QM)
63
3.12 USB connectivity
64
3.12.1 USB routing recommendations
65
3.12.2 USB VBUS and ID pin voltages
66
3.12.3 USB Type-C considerations
66
3.13 HDMI/display port connectivity (i.MX8 QM)
67
3.14 Unused input/output terminations
68
3.14.1 i.MX8 QM unused input/output guidance
68
3.14.2 i.MX8 QXP unused input/output guidance
71
3.15 GPIO pin strategies
73
3.15.1 Allocating GPIOs
73
3.15.2 Planning for GPIO voltage supplies
74
3.15.3 Facilitating debug
74
4 Thermal considerations
75
4.1 Introduction
75
4.2 PCB dimensions
75
4.3 Copper volume
75
4.4 PCB material selection
77
4.5 Thermal resistance
77
4.5.1 Heat spreaders
77
4.5.2 Thermal vias
77
4.6 Power net design
77
4.7 Component placement
78
4.8 PCB surroundings
78
4.8.1 Air flow considerations
78
4.9 Heat sink considerations
78
4.10 Thermal simulations
79
4.11 Software optimization
79
4.12 Thermal checklist
79
5 Avoiding board bring-up problems
81
5.1 Introduction
81
5.2 Avoiding power pitfalls - current
81
5.3 Avoiding power pitfalls - voltage
81
5.4 Checking for clock pitfalls
83
5.5 Avoiding reset pitfalls
83
5.6 Sample board bring-up checklist
83
6 Using BSDL for board-level testing
86
6.1 How BSDL works
86
6.2 Boundary scan operation
86
6.3 I/O pin power considerations
86
7 Revision history
87
5
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NXP Semiconductors i.MX8 QM Specifications
General
Brand
NXP Semiconductors
Model
i.MX8 QM
Category
Control Unit
Language
English
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