Figure 33. PCB stack-up of the i.MX8QM MEK board
If a board stack-up with a lower layer count is desired, use higher-density copper layers for the power and ground planes to assist
with the board’s thermal dissipation.
Figure 34. Stack-up of the i.MX8QXP MEK board
NXP Semiconductors
Thermal considerations
i.MX8 QM / i.MX8 QXP Hardware Developer’s Guide, Rev. 2.4p, 06/2021
User's Guide 76 / 89
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