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Renkforce RF500 Maker Construction Kit - Page 92

Renkforce RF500 Maker Construction Kit
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92
Control Temperature Ext. Min: 210 Ext. Min: 210
Ext. Max: 250 Ext. Max: 250
Ext. Fact: 000.10 Ext. Fact: 000.10
PID-P: +022.20 PID-P: +022.20
PID-I: +001.08 PID-I: +001.08
PID-D: +114.00 PID-D: +114.00
PID-C: 100 PID-C: 100
Preheat PLA conf Temperature
Fan speed: 0 Fan speed: 0
Nozzle: 180 Nozzle: 180
Bed: 70 Bed: 70
Store memory
Preheat ABS conf Temperature
Fan speed: 0 Fan speed: 0
Nozzle: 240 Nozzle: 240
Bed: 110 Bed: 110
Store memory
Motion Control
Accel: 1000 Accel: 1000
VXY-jerk:5 VXY-jerk:5
Vz-jerk: +000.40 Vz-jerk: +000.40
Ve-jerk: 5 Ve-jerk: 5
VmaxX:300 VmaxX:300
VmaxY:300 VmaxY:300
Vmax Z: 5 Vmax Z: 5
Vmax E: 100 Vmax E: 100
Vmin: 0 Vmin: 0
VTrav min: 0 VTrav min: 0
AmaxX:3000 AmaxX:3000
AmaxY:3000 AmaxY:3000
Amax Z: 0 Amax Z: 0
Amax E: 9000 Amax E: 9000
A-retract: 9000 A-retract: 9000
A-travel: 1000 A-travel: 1000
Xsteps/mm:+080.00 Xsteps/mm:+080.00
Ysteps/mm:+080.00 Ysteps/mm:+080.00
Zsteps/mm: +1060.0 Zsteps/mm: +1060.0
Esteps/mm: +0127.0 Esteps/mm: +0127.0
Filament Control
E in mm3: Off/On
Fil. Dia.: 1,750 Fil. Dia.: 1,750
Store memory
Load memory
Restore failsafe
NoSDCard/PrintfromSD Main
Folder structure of the SD card

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