(Trouble codes and countermeasures)
Trouble code Sub code Content Possible cause Countermeasure
F2 31 Image exposure sensor error
Photoconductor surface
reflection detection error
Copier operation halt when
sensing
Dirt on the image density sensor (ID) Clean the image density sensor and
its peripheral. Use soft cloth
immersed in water or alcohol to clean
the sensor surface.
Dirt on the drum surface by
incomplete cleaning
Check the cleaning blade and the
photoconductor drum surface and
replace them if necessary.
Image density sensor (ID) sensing
level is not adjusted.
Execute simulation No. 44-3. (Set to
204±10 with VR2.)
Image density sensor (ID) PWB
trouble
* Process control VR PWB trouble
F2 32 Drum mark sensor trouble
Surface level and drum mark
sensing abnormality
Copier operation halt when
sensing.
Dirt on the drum mark sensor (DM) Clean the drum mark sensor (DM)
and its peripheral. Use soft cloth
immersed in water or alcohol to clean
the sensor surface.
Dirt on the drum surface by incomplete
cleaning
Check the cleaning blade and the
photoconductor drum surface, and
replace them if necessary.
Drum mark sensor (DM) sensing level
is not adjusted.
Improper drum (drum without mark)
Execute simulation No. 44-2. (Set to
204±10 with VR1.)
* Drum mark sensor (DM) PWB
trouble
* Process control VR PWB trouble
F2 35 Process control operation
failure
When 1 or 2 is detected,
process control is fixed to the
reference condition.
In case of an accidental
trouble caused by the change
in environments (temperature,
humidity), if the inside state of
the machine recovers, then
the trouble will be cleared.
1 Image density is too high to be
corrected. (When executing
simulation No. 44-6)
Developer/toner density changes
greatly.
Humidity and temperature is low.
Check the developer unit.
Visually check the pressure contact
and the lock state.
• Check the high voltage output.
Simulation No. 44-11.
2 Image density is too low to be
corrected.
(When executing simulation No.
44-6)
Developer/toner density changes
greatly.
Humidity and temperature change
greatly.
NORMAL: –860V
PATCH: –610V
Simulation No. 8-1
DV BIAS: –300V
• Developer stirring
Simulation No. 25-1.
Replace the developer.
7 – 24
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