RF600 system planning
4.9 Guidelines for electromagnetic compatibility (EMC)
SIMATIC RF600
System Manual, 11/2018, J31069-D0171-U001-A21-7618
91
What interference can affect RFID?
Table 4- 16 Interference sources: Causes and remedies
Switched-mode power supply Interference emitted from the
Replace the power supply
Interference injected through
the cables connected in
series
Cable is inadequately shield-
ed
Better cable shielding
The reader is not connected
Ground the reader
HF interference over the
antennas
caused by another reader
• Position the antennas further
apart.
• Erect suitable damping materials
between the antennas.
• Reduce the power of the readers.
Please follow the instructions in the
section
Installation guidelines/reducing
the effects of metal
4.9.5 Equipotential bonding
Potential differences between different parts of a plant can arise due to the different design
of the plant components and different voltage levels. If the plant components are connected
across signal cables, transient currents flow across the signal cables. These transient
currents can corrupt the signals.
Proper equipotential bonding is thus essential.
● The equipotential bonding conductor must have a sufficiently large cross section (at least
10 mm
2
).
● The distance between the signal cable and the associated equipotential bonding
conductor must be as small as possible (antenna effect).
● A fine-strand conductor must be used (better high-frequency conductivity).
● When connecting the equipotential bonding conductors to the centralized equipotential
bonding strip (EBS), the power components and non-power components must be
combined.
● The equipotential bonding conductors of the separate modules must lead directly to the
equipotential bonding strip.