Safety information
2.2 General safety instructions
Automation system
24 System Manual, 01/2023, A5E03461182-AK
2.2.11 Material damage
2.2.11.1 Transport and storage
• Only pack, store, transport and ship electronic components, modules or devices in the
original product packaging or in other suitable materials, e.g. conductive foam rubber or
aluminum foil.
• Transport the device only in the transport packaging provided.
• Observe the limits during transport and storage. See section Technical specifications.
2.2.11.2 Installation and connection
• Only touch components, modules and devices when you have grounded yourself with one
of the following measures:
– With an ESD wrist strap
– With ESD shoes or ESD grounding strips in ESD areas with conductive flooring.
• Place electronic components, modules and devices only on conductive surfaces (e.g.
tables with ESD coating, conducting ESD plastic foam, ESD packing bags, ESD transport
containers).
• Ensure that there is sufficient overvoltage protection.
• Do not install/remove the following elements when the power is on:
– Front connectors
– I/O modules
– CPU
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