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Siemens Simatic S7-1500 / ET 200MP - Mechanical and Climatic Ambient Conditions

Siemens Simatic S7-1500 / ET 200MP
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Technical specifications
16.5 Mechanical and climatic ambient conditions
Automation system
350 System Manual, 01/2023, A5E03461182-AK
16.5 Mechanical and climatic ambient conditions
Operating conditions
The S7-1500 automation system/ET 200MP distributed I/O system is suitable for use in
weather-proof, fixed locations. The operating conditions are based on the requirements of
IEC 61131-2:2017.
OTH4 (S7-1500 CPUs: For the minimum ambient temperature, see the Climatic ambient
temperatures table)
STH4 (S7-1500 CPUs: Minimum ambient temperature -40 °C, minimum relative humidity
5%)
TTH4 (S7-1500 CPUs: Minimum relative humidity 5%)
Test of mechanical ambient conditions
The table below provides important information with respect to the type and scope of the
test of ambient mechanical conditions.
Table 16- 7 Test of mechanical ambient conditions
Condition tested
Test Standard
Comment
Vibration
Vibration test accord-
ing to IEC 60068-2-6
(Sinus)
Type of oscillation: Frequency sweeps with a rate of change of 1 oc-
tave/minute.
5 Hz f 8.4 Hz, constant amplitude 7 mm
8.4 Hz f 150 Hz, constant acceleration 2 g
Duration of vibration: 10 frequency sweeps per axis, along each of the 3
mutually perpendicular axes
Shock
Shock, tested accord-
ing to IEC 60068-2-27
Type of shock: Half-sine
Shock intensity: 15 g max., duration 11 ms
Direction of shock: 3 shocks each in (+/-) direction, along each of the 3
mutually perpendicular axes
Continuous shock Shock, tested accord-
ing to IEC 60068-2-27
Type of shock: Half-sine
Shock intensity: 250 m/s
2
peak value, 6 ms duration
Direction of shock: 1000 shocks each in (+/-) direction, along each of the 3
mutually perpendicular axes
Reduction of vibrations
If your S7-1500 automation system/ET 200MP distributed I/O system is exposed to severe
shock or vibration, take appropriate measures to reduce the acceleration or the amplitude.
We recommend the installation of the S7-1500 automation system/ET 200MP distributed I/O
system on damping materials (for example, rubber-bonded metal mounting).

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