ST STM32 Application Note

Revision history AN2834
48/49 DocID15067 Rev 3
5 Revision history
Table 1. Document revision history
Date Revision Changes
14-Nov-2008 1 Initial release.
16-Sep-2013 2
Extended to STM32Fx Series and STM32L1 Series devices.
Added Section 1.1: SAR ADC internal structure.
Added Section 3.4: High impedance source measurement.
Added Section 3.3: Software methods to improve precision.
Text improvements and additions.
Changed the Disclaimer on the final page.
15-Feb-2017 3
Document scope extended to all STM32 microcontrollers.
Updated Figure 5: Step 2: If MSB = 0, then compare with ¼VREF and
Figure 6: Step 2: If MSB = 1, then compare with ¾VREF.
Updated Section 3.3: Software methods to improve precision
introduction.
Added STM32L0/L4 ADC hardware oversampling in Section 3.2.3:
Analog-input signal noise elimination, Section 3.2.4: Adding white
noise or triangular sweep to improve resolution and Section 3.3.1:
Averaging samples.
Harmonized hexadecimal notation to ‘0x’.
Harmonized least significant bit term to ‘LSB’.
Updated figures look-and-feel and ground symbol. Color legend
added when required.

ST STM32 Specifications

General

Series	STM32
Category	Microcontrollers
Core	ARM Cortex-M0, Cortex-M0+, Cortex-M3, Cortex-M4, Cortex-M7, Cortex-M33
Clock Speed	Up to 480 MHz
GPIO Pins	Up to 144
Communication Interfaces	I2C, SPI, USART, USB, CAN, Ethernet
Package Types	LQFP, BGA, WLCSP
ADC Resolution	12-bit, 16-bit (varies by series)
DAC Resolution	12-bit (varies by series)
Operating Temperature	-40°C to +85°C or +105°C