STMicroelectronics STM32F038C6 User Manual

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STM32F038x6 Electrical characteristics
79
APB
APB-Bridge
(2)
2.6
µA/MHz
SYSCFG 1.7
ADC
(3)
4.2
TIM1 17.1
SPI1 9.6
USART1 17.4
TIM16 8.2
TIM17 8.0
DBG (MCU Debug Support) 0.5
TIM2 17.4
TIM3 12.8
TIM14 6.0
WWDG 1.5
I2C1 5.1
PWR 1.2
All APB peripherals 110.9
1. The BusMatrix automatically is active when at least one master is ON (CPU or DMA1).
2. The APBx Bridge is automatically active when at least one peripheral is ON on the same Bus.
3. The power consumption of the analog part (I
DDA
) of peripherals such as ADC is not included. Refer to the
tables of characteristics in the subsequent sections.
Table 27. Peripheral current consumption (continued)
Peripheral Typical consumption at 25 °C Unit

STMicroelectronics STM32F038C6 Specifications

General

Series	STM32F0
Core	ARM Cortex-M0
Operating Frequency	48 MHz
Flash Memory Size	32 KB
RAM Size	4 KB
Number of I/Os	39
ADC Resolution	12-bit
ADC Channels	10
Operating Temperature	-40°C to 85°C
Operating Voltage	2.0 V to 3.6 V
Communication Interfaces	I2C, SPI, USART
Package	LQFP48

Summary

Introduction

Description

Functional Overview

Core, Memory, and Boot Modes

Details on ARM Cortex-M0 core, memory, and startup boot options.

Power and Clock Management

Power supply schemes, low-power modes, and clock configurations.

ADC

12-bit ADC with multiple channels for analog-to-digital conversion.

Timers, Watchdogs, and Communication Interfaces

Covers Timers, Watchdogs, I2C, USART, SPI/I2S.

Debug Interface

Serial wire debug port (SW-DP) for debugging.

Pinouts and Pin Description

Memory Mapping

Electrical Characteristics

Parameter Conditions and Ratings

Defines measurement conditions, min/max values, and absolute maximum ratings.

Operating Conditions and Current Consumption

Specifies operating ranges and current draw in various modes.

Clock, I/O, and Sensitivity Characteristics

Covers clock sources, I/O behavior, and electrical sensitivity.

Peripheral Specific Characteristics

Details specific characteristics of ADC, Timers, and Communication Interfaces.

Package Information

Package Types and Mechanical Data

Covers LQFP48, UFQFPN32, UFQFPN28, WLCSP25, and TSSOP20 packages.

Thermal Characteristics

Package thermal resistance and calculation of junction temperature.

Part Numbering

Revision History