SUSS MJB4 - 3. OPERATION OF THE MJB4

OPERATION OF THE MJB4
MJB4 - Operation Rev07 05-10 15
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3. OPERATION OF THE MJB4
The MJB4 Mask Aligner allows contact exposures of
different types (vacuum, hard, soft contact) as well
as exposures at short distances and can be used to
transfer structure dimensions down to the submicron
range.
The achievable alignment accuracy X, Y and Theta
is below 1 µm.
Masks and wafer/substrates to a total thickness of
9.00 mm can be processed.
The MJB4 is equipped with 400 nm exposure optics
and lamps that allow a resolution of< 1µm in vacuum
contact. Using 300 nm or 250 nm exposure optics or
an Excimer laser results in a significantly higher
resolution.
Unitary construction ensures that the components
are easy to service. Function groups are easy to
reach and the individual Unites, such as for the
pneumatic system and the PLC controller, can be
quickly replaced.
SUSS MJB4 Mask Aligner
1 Lamp house
2 TSA microscope manipulator
3 Microscope focus setting
4 TSA microscope
5 TSA/IR illumination
6 Electronics ON/OFF key
7 Main switch with emergency off function
8 Alignment stage
9 Monitor for microscope video image (option)
10 Pneumatic settings
11 Display/touch screen
12 Pneumatic gauges
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