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Guidelines for safe operation and handling of the mask aligner, emphasizing trained personnel.
Explains the meaning of danger, warning, and instruction symbols used in the manual.
Specifies the machine's intended application in photolithography for semiconductor technology.
Details the main power switch and its emergency shutdown function.
Covers various hazards including physical, thermal, electrical, radiation, and poisoning risks.
Provides guidance for qualified personnel on operating and servicing the MJB4 Mask Aligner.
Outlines essential conditions for optimal machine operation, including ambient requirements.
Details procedures and safety precautions for moving the mask aligner.
Defines key terms and concepts, including the coordinate system used for positioning.
Describes the main switch, alignment stage controls, and the display/touch screen interface.
Explains the user interface, including the start screen, main menu, and navigation flow.
Details the step-by-step procedures for powering on/off, calibrating, and setting up the machine.
Guides on aligning substrates using the microscope, covering parameter settings and mask/substrate loading.
Explains the process for aligning substrates using IR illumination, including specific steps for incident and transmitted light.
Describes different exposure types like distance, soft contact, hard contact, and vacuum contact.
Provides detailed operational sequences for selecting programs, saving, loading, and executing exposures.
Describes a special application process for Nano Imprint Lithography (NIL) on the MJB4.
Lists the configurable parameters, their default values, and valid ranges for machine processes.
Provides a detailed overview of system components including valves, throttles, controllers, and sensors.
Details the safety procedure for locking and tagging out energy sources during maintenance.
General| Brand | SUSS |
|---|---|
| Model | MJB4 |
| Category | Laboratory Equipment |
| Language | English |
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