OPERATION OF THE MJB4
34 MJB4 - Operation Rev07 05-10
3
3.6.2.6. Exposure
Once the substrate is aligned and brought to the
exposure position using the SEPARATION LEVER,
press the Exposure button to perform the exposure.
You must press Yes again on the display to confirm
the exposure.
If you press No or use the CONTACT or
SEPARATION LEVER, the shutter keeps closed.
The substrate can now be unloaded or readjusted.
After pressing Yes the shutter will be opened for the
programmed exposure time.
Caution!
Microscope in motion!
3.6.2.7. Unloading the Mask
To release the mask holder, remove both screws on
the right side of the mask holder frame. Take out the
mask holder and place it on a tray upside down.
Switch off the mask vacuum by pressing the button
„Mask vacuum is on“ .
The mask can now be removed.
3.7. Exposure Programs
An important parameter for exposure is the type of
contact between the mask and substrate. The type
of exposure program and all required parameters
are selected and edited in the Parameters menu.
3.7.1. Distance Exposure
Wedge error compensation takes place in contact.
After the substrate is adjusted to the mask, exposure
is carried out at a specific distance up to 50 µm.
The substrate intake vacuum is maintained during
exposure.
3.7.2. Soft Contact Exposure
The mask and substrate are brought into contact.
The structure resolution is better than in distance
exposure. The substrate intake vacuum is
maintained during exposure. The pressing force of
the substrate against the mask is equal to the force
applied for wedge error compensation.
3.7.3. Hard Contact Exposure
This exposure type is similar to the soft contact
exposure. After the substrate is in contact, the
substrate intake vacuum is switched off and
replaced with nitrogen overpressure. This
guarantees better contact, even for exposing larger
substrates. To test the set values and adjustment,
use the Alignment check button in the Exposure
menu.
3.7.4. Vacuum Contact Exposure
This exposure type ensures the highest structure
resolution. It requires a vacuum-capable chuck with
a sealing lip. The substrate is in a mini vacuum
chamber from which the air is gradually extracted.
The pre-vacuum ensures that the mask-substrate
contact is established slowly. It also prevents gas
bubbles from forming under the substrate. In the
next stage the final vacuum is applied. The intake
vacuum is then replaced with nitrogen overpressure.
This results in the best possible contact between the
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