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Textron Cessna 182S User Manual

Textron Cessna 182S
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CESSNA
AIRCRAFT
COMPANY
MODEL
182/T182
WIRING
DIAGRAM
MANUAL
SOLDERING
-
MAINTENANCE
PRACTICES
1.
General
A.
This
section
describes
procedures
for
making
solder
joints
with
a
filler
metal
having
a
flow
temperature
below
800°
F.
(Refer
to
Figures
201,
202,
203,
204, 205,
206,
and
207)
B.
Electrical
wiring
and
connections
should
be
soldered
with
a
tin-lead
solder
using
a
noncorrosive
flux.
2.
Tools
and
Equipment
A.
Solder.
COMPOSITION
PERCENT
BY
WEIGHT
TEMPERATURE
SOLIDUS LIQ-
F
UIDUS
°F
Tin
60
Lead
40
361
Tin
63
Lead
37
360
374
General
purpose
for
connection
(applications
below
250°F)
360
Special
purpose
electrical
wiring
and
printed
circuits
where
temperature
limitations
are
critical.
Flux:
Use
Rosin
Core
Solder
QQ-S-571
E
WRMAP2
Flux
Solvent:
Aliphatic
Naph-
tha
(TT-N-95)
or
Trichloroethy-
lene
(ASTM
D4080)
Flux:
Use
Rosin
Core
Solder
QQ-S-571
E
WRMAP2
Flux
Solvent:
Aliphatic
Naph-
tha
(TT-N-95)
or
Trichloroethy-
lene
(ASTM
D4080)
©
Cessna
Aircraft
Company
20-10-03
Page
201
Mar
1/2004
I
CLASS
AWS
ASTM
USAGE
FLUX
AND
FLUX
SOLVENT
SN
60
QQ-S-571
E
SN
63
(QQ-S-
571
E)
(WRMAP2)

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Textron Cessna 182S Specifications

General IconGeneral
BrandTextron
ModelCessna 182S
CategoryTools
LanguageEnglish

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