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Dell EMC PowerEdge XE8545 - Nvidia A100 GPU Assembly Procedures

Dell EMC PowerEdge XE8545
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Nvidia A100 GPU assembly
Thermal restriction matrix
Table 9. Thermal restriction matrix
TDP (W) Heat sink type Fan Type 2 x 2.5" SAS + 8 x 2.5" NVMe
- ASHRAE A2
(Max 35° C)
Ambient Limit
(Max 30° C)
Ambient Limit
(Max 25° C)
Ambient Limit
(Max 20° C)
AMD Milan 64C
280W 2.5-2.6
GHz 256 MB
2U CPU Heat
sink
Very High
Performance
Fan
Supported
AMD Milan 24C
240W 3.15 GHz
256 MB
AMD Milan 64C
225W 2.05-2.15
GHz 256 MB
AMD Milan 32C
225W 2.7-2.8
GHz 256 MB
AMD Milan 64C
225W 2.0 GHz
256 MB
AMD Milan 48C
225W 2.2-2.3
GHz 256 MB
AMD Milan 24C
180W 2.55-2.65
GHz 128 MB
Table 10. GPU/FPGA thermal restriction matrix
TDP (W) Heat sink type Fan Type ASHRAE A2
(Max 35° C)
Ambient Limit
(Max 30° C)
Ambient Limit
(Max 25° C)
Ambient Limit
(Max 20° C)
Nvidia 500 W
A100 80 GB
GPU
2.5U GPU Heat
sink
Very High
Performance
Fan
Not supported
Not supported
(Max ambient
support limit =
28° C)
Supported Supported
Nvidia 400 W
A100 40 GB
GPU
Supported Supported Supported Supported
NOTE: When the 80 GB GPUs are installed, the iDRAC sets the thermal warning threshold to 28° C instead of the normal
38° C.
NOTE: If System Board Inlet Temp reaches 28° C - 32° C, a warning message is logged. It is possible the GPUs may lower
power consumption to avoid thermal damage. This results in lower GPU performance.
Table 11. Processor and heat sink matrix
Heat sink Processor TDP
2U HPR (Silver) HSK Supports all TDP
Installing and removing system components 49

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