Component Hot swap
Hot expan-
sion
Remarks
Power supply unit (PSU)
¡
— —
Disk (HDD)
¡ ¡
—
SSD
¡ ¡
—
Operation panel (PANEL) ´
(*5) — —
I/O module (IOM)
¡
¡ (*6) —
Fan Expander Module (FEM) (*7)
¡
— —
Disk firmware ¡ (*4) — —
¡: Allowed / ´: Not allowed (cold swap is possible) /
—: Not applicable
*1 : Mid Plane. This is a board that is located between the front (drive side) and rear (controller
(CM) or I/O module (IOM) side) of the
ETERNUS DX.
*2: All of the host interfaces on the CM that will have maintenance or expansion performed go
offline. When a multipath configuration is used, switch to the host paths of the CM that will not
have maintenance performed to continue operation.
*3: System volumes must be created if Unified License is installed.
*4: Depending on the changes in the firmware, this function may require I/Os to be temporarily
stopped.
*5: Operation can be continued during a failure. The status of the ETERNUS DX can be monitored
via ETERNUS Web GUI or ETERNUS CLI.
*6: Hot expansion can only be performed when it is expanded together with a CM in a single-con-
troller configuration.
*7: FEMs are installed in high-density drive enclosures.
6. Maintenance/Expansion
Hot Swap/Hot Expansion
196
Fujitsu Storage ETERNUS DX100 S4/DX200 S4, ETERNUS DX100 S3/DX200 S3 Hybrid Storage Systems
Design Guide (Basic)
Copyright 2023 Fujitsu Limited
P3AM-7642-32ENZ0