Fujitsu ETERNUS DX100 S3 - Table 56 Hot Swap and Hot Expansion Availability for Components (ETERNUS DX100 S3;DX200 S3)

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Hot Swap/Hot Expansion (
ETERNUS DX100 S3/DX200 S3)
The table below shows whether hot swap or hot expansion for components of the ETERNUS DX100
S3/DX200 S3 is possible.
Table 56 Hot Swap and Hot Expansion Availability for Components (ETERNUS DX100 S3/DX200 S3)
Component Hot swap
Hot expan-
sion
Remarks
Controller enclosure (CE)
´
— Replace the controller enclosure (CE)
when the MP (*1) fails.
Controller module (CM) ¡ (*2) (*3)
¡
—
Cache memory ¡ (*2) — —
Memory Extension ¡ (*2) ¡ (*2) (*4) —
Controller firmware ¡ (*2) (*3)
(*5)
— Make sure to stop I/Os before imple-
mentation in a Unified configuration.
Host interface (FC-CA) ¡ (*2) ¡ (*2) —
Host interface (10G iSCSI-CA) ¡ (*2) ¡ (*2) —
Host interface (1G iSCSI-CA) ¡ (*2) ¡ (*2) —
Host interface (FCoE-CA) ¡ (*2) ¡ (*2) —
Host interface (SAS-CA) ¡ (*2) ¡ (*2) —
Host interface (10G Ethernet-CA) ¡ (*2) (*3) ¡ (*2) (*3) —
Host interface (1G Ethernet-CA) ¡ (*2) (*3) ¡ (*2) (*3) —
Power supply unit (PSU)
¡
— —
Disk (HDD)
¡ ¡
—
SSD
¡ ¡
—
Operation panel (PANEL) ´
(*6) — —
Disk firmware ¡ (*5) — —
Drive enclosure (DE)/high-density drive en-
closure (HD-DE)
¡ ¡
Replace the drive enclosure (DE)/
high-density drive enclosure (HD-DE)
when the MP (*1) fails.
Power supply unit (PSU)
¡
— —
Disk (HDD)
¡ ¡
—
SSD
¡ ¡
—
Operation panel (PANEL) ´
(*6) — —
I/O module (IOM)
¡
¡ (*7) —
Fan Expander Module (FEM) (*8)
¡
— —
Disk firmware ¡ (*5) — —
¡: Allowed / ´: Not allowed (cold swap is possible) /
—: Not applicable
*1 : Mid Plane. This is a board that is located between the front (drive side) and rear (controller
(CM) or I/O module (IOM) side) of the
ETERNUS DX.
*2: All of the host interfaces on the CM that will have maintenance or expansion performed go
offline. When a multipath configuration is used, switch to the host paths of the CM that will not
have maintenance performed to continue operation.
6. Maintenance/Expansion
Hot Swap/Hot Expansion
197
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