Fujitsu Primergy RX300 S3 Operating Manual

90 Operating manual RX300 S3
Hot-plug PCI Boards Hot-plug Components
Ê Place the removed fan away from the server.
V CAUTION!
Never place the removed/defective fan within the server, thus
preventing a short circuit.
Ê Pull the green handle of the new fan, insert the fan into the fan cartridge and
push the handle into position to engage the locking mechanism.
I The fans in the new fan unit are measured via express commands in
the server management. As a function of the results the LED (see
figure 28 on page 89) is set to light up green (fan o.k.) or to light up
orange (fan defective).
Ê Replace the housing cover (see section “Opening/Closing the Housing” on
page 95).
8.4 Replacing hot-plug PCI Boards
V CAUTION!
The actions described in this section may only be performed by
personnel with the appropriate technical training. Any unauthorized
openings and improper repairs could expose the user to risks
(electric shock, fire hazards) and could also damage the equipment.
Please observe the safety information in chapter “Important Notes”
on page 23.
In order to replace a hot-plug PCI board, the housing cover must be removed
as the slots are not directly accessible (see section “Opening/Closing the
Housing” on page 95).
V CAUTION!
The housing cover must be replaced as fast as possible due to cooling,
to comply with applicable EMC regulations (regulations on electromag-
netic compatibility) and to protect against fire. the maximum opening time
of the housing cover amounts to 15 minutes.
The failure of a hot-plug PCI board is notified on the corresponding slot on the
rear of the server (see table 5 on page 56).

Fujitsu Primergy RX300 S3 Specifications

General

Tcase	78 °C
Bus type	FSB
FSB Parity	Yes
Processor cache	4 MB
Processor cores	2
Processor model	5080
Processor series	Intel Xeon 5000 Series
Processor socket	LGA 771 (Socket J)
Processor threads	4
Processor codename	Dempsey
Motherboard chipset	Intel® 5000P
Processing Die size	162 mm²
Processor frequency	3.73 GHz
Processor cache type	L2
Processor lithography	65 nm
Processor system type	DP
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	1066 MHz
Processor operating modes	64-bit
ECC supported by processor	No
Thermal Design Power (TDP)	130 W
Processor core voltage (AC)	1.25 - 1.40 V
CPU multiplier (bus/core ratio)	14
Number of Processing Die Transistors	376 M
Maximum graphics card memory	8 MB
Memory slots	8
Internal memory	2 GB
Internal memory type	DDR2-SDRAM
Maximum internal memory	32 GB
Memory layout (slots x size)	2 x 1 GB
Networking features	Ethernet/Fast Ethernet/Gigabit Ethernet
Expansion slots	1 x PCIe x8, 2 x PCIe x4, 2 x PCI-X
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Noise level	56 dB
Chassis type	Rack (2U)
Compatible operating systems	Windows Server 2003, Novell SUSE Linux Enterprise Server, Red Hat Enterprise Linux, VMware ESX
I/O ports	8 x SAS
Power supply	600 W
Power requirements	100 - 240V, 50/60 Hz
Operating temperature (T-T)	10 - 35 °C
Safety	IEC 60950-1, EN 60950-1
Electromagnetic compatibility	EN 55 022 A, EN 55024, EN 61000-3-2 / -3-3
RAID levels	1, 5, 10, 50
Processor ARK ID	27213

Weight and Dimensions

Depth	785 mm
Width	483 mm
Height	86 mm
Weight	25000 g