HP BladeSystem c7000 Maintenance And Service Guide

Component identification 64
Component identification
Enclosure front components
Item Description
1
Device bays*
2
Air intake slot (Do not block.)
3
Power supply bay 1
4
Power supply bay 2
5
Power supply bay 3
6
Power supply bay 4
7
Insight Display
8
Power supply bay 5
9
Power supply bay 6
10
Air intake slot (Do not block.)
*For more information, see "Device bay numbering (on page 64)."
Device bay numbering
Each enclosure requires interconnects to provide network access for data transfer. Interconnects reside in
bays located on the rear of the enclosure. Be sure to review device bay numbering to determine which
external network connections on the interconnects are active.

HP BladeSystem c7000 Specifications

General

Form Factor	10U
Number of Bays	16
Redundant Power	Yes
Redundant Fans	Yes
Maximum Blade Servers	16 half-height or 8 full-height
Operating Temperature	10° to 35°C (50° to 95°F)
Power Supplies	Up to 6
Cooling Fans	10
Management	Onboard Administrator
Interconnect Modules	Up to 8
Networking Options	Ethernet, Fibre Channel, InfiniBand
Compatibility	HP ProLiant and Integrity server blades
Relative Humidity	10% to 90% (non-condensing)