HP BladeSystem c7000 Maintenance And Service Guide

Removal and replacement procedures 42
4.
Remove the interconnect bay divider.
To replace the component, reverse the removal procedure.
Onboard Administrator blank
Remove the component as indicated.
CAUTION: For best cooling practices, do not operate the enclosure for extended periods with
more than one component or blank removed. When removing an active component, replace it
with a blank.
To replace the component, reverse the removal procedure.

HP BladeSystem c7000 Specifications

General

Form Factor	10U
Number of Bays	16
Redundant Power	Yes
Redundant Fans	Yes
Maximum Blade Servers	16 half-height or 8 full-height
Operating Temperature	10° to 35°C (50° to 95°F)
Power Supplies	Up to 6
Cooling Fans	10
Management	Onboard Administrator
Interconnect Modules	Up to 8
Networking Options	Ethernet, Fibre Channel, InfiniBand
Compatibility	HP ProLiant and Integrity server blades
Relative Humidity	10% to 90% (non-condensing)