24 323094 Dev Kit Manual
Note: Software in the kit is provided free by the vendor and is only licensed for evaluation purposes.
Refer to the documentation in your evaluation kit for further details on any terms and
conditions that may be applicable to the granted licenses. Customers using the tools that work
with Microsoft* products must license those products. Any targets created by those tools
should also have appropriate licenses. Software included in the kit is subject to change.
3.5 BIOS Key Features
This development kit ships with AMI* BIOS pre-boot firmware from AMI* preinstalled. AMI*
BIOS provides an industry-standard BIOS on which to run most standard operating systems,
including Windows* XP/XP Embedded, Linux*, and others.
The following features of AMI* BIOS are enabled in the development board:
DDR3 detection, configuration, and initialization
Intel
®
QM57 Chipset configuration
POST codes displayed to port 80h
PCI/PCI Express* device enumeration and configuration
Integrated video configuration and initialization
Super I/O configuration
Active Management Technology
Intel
®
Matrix Storage Manger RAID 0/1 Support
3.6 System Thermal Management
The objective of thermal management is to ensure that the temperature of each component is
maintained within specified functional limits. The functional temperature limit is the range
within which the electrical circuits can be expected to meet their specified performance
requirements. Operation outside the functional limit can degrade system performance and
cause reliability problems.
The development kit is shipped with a heatsink thermal solution for installation on the
Processor. This thermal solution has been tested in an open-air environment at room
temperature and is sufficient for development purposes. The designer must ensure that
adequate thermal management is provided for if the system is used in other environments or
enclosures.
3.7 System Features and Operation
The following section provides a detailed view of the system features and operation of the
development kit. They are divided into the two sections based upon component: the first
section describes the processor‟s features and the following section describes the chipset‟s
features.
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