Nexcom VTC 7260 - Key Features; Hardware Specifications

Copyright © 2022 NEXCOM International Co., Ltd. All Rights Reserved.
10
Chapter 1: Product Introduction
VTC 7260 Series User Manual
Key Features
• Intel
®
11th Gen, Tiger Lake UP3, cost-efficient performance
• Compact, rugged and fanless design
• Rich I/Os, 4 x PoE+, GbE, 4 x USB 3.2/2.0 & 2 x RS232/422/485
• 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
• Up to 3 combinations of LTE/5G, Wi-Fi 5/6 for mobile router function
• Triple display, VGA, HDMI and DP for multi video-out
• 9~36V DC-IN with ignition control & OCP/OVP
• Wide range operating temperature of -40°C~70°C
• Military standard of anti-vibration/shock for OHV applications
• CE/FCC, UKCA, Emark Certified
Hardware Specifications
CPU
▪ Intel
®
Core™ 11th Gen. Tiger Lake UP3
▪ Core i5-1145GRE, base frequency 1.5GHz/ 2.6GHz, 4c, 8 MB
Intel® Smart Cache (VTC 7260-5C)
▪ Core i7-1185GRE, base frequency 1.8GHz/ 2.8GHz, 4c, 12 MB
Intel
®
Smart Cache (VTC 7260-7)
▪ Graphics:
▪ - Intel
®
Iris
®
X
e
graphics, 1.3GHz
▪ - Max resolution: 4096 x 2304@60Hz (HDMI)
▪ - DirectX: 12.1, OpenGL: 4.6
Memory
▪ 2 x SO-DIMM, DDR4-3200MHz
▪ 4GB+4GB in default, 64GB in max.
▪ ECC (in-band ECC), dual- channel support
Storage
▪ 1 x 2.5” SSD (15mm height)
▪ 1 x mPCIe for mSATA (SATA 3.0)
▪ 1 x M.2 2242/2280 Key M NVMe SSD (PCIe 4.0 x4), Hailo AI card in
option
Expansion
▪ 1 x mPCIe socket (PCIe 3.0 + USB 2.0/ USB 3.2), 2 x micro SIMs supported
▪ 1 x M.2 3042/3050/3052 Key B socket (USB 3.2), 2 x micro SIMs
supported
▪ 1 x M.2 2230 Key E socket (PCIe 3.0 x2 & USB 2.0), Wi-Fi or Hailo AI card
in option
Note:
There are two types of Hailo AI card that can be installed, one is
KeyE form factor that can be installed on the Key E 2230 slot on
VTC7260, the other is KeyM form factor that can be installed on
Key M 2242/2280 slot on VTC7260. To purchase, please contact
NEXCOM sales.