LPC5411x All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2018. All rights reserved.
Product data sheet Rev. 2.1 — 9 May 2018 47 of 105
NXP Semiconductors
LPC5411x
32-bit ARM Cortex-M4/M0+ microcontroller
[8] An ADC input voltage above 3.6 V can be applied for a short time without leading to immediate, unrecoverable failure. Accumulated
exposure to elevated voltages at 4.6 V must be less than 10
6
s total over the lifetime of the device. Applying an elevated voltage to the
ADC inputs for a long time affects the reliability of the device and reduces its lifetime.
[9] It is recommended to connect an overvoltage protection diode between the analog input pin and the voltage supply pin.
[10] Dependent on package type.
9. Thermal characteristics
The average chip junction temperature, T
j
(C), can be calculated using the following
equation:
(1)
• T
amb
= ambient temperature (C),
• R
th(j-a)
= the package junction-to-ambient thermal resistance (C/W)
• P
D
= sum of internal and I/O power dissipation
The internal power dissipation is the product of I
DD
and V
DD
. The I/O power dissipation of
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
Table 11. Thermal resistance
Symbol Parameter Conditions Max/Min Unit
LQFP64 Package
R
th(j-a)
thermal resistance from
junction to ambient
JEDEC (4.5 in 4 in); still air 58 15 % C/W
Single-layer (4.5 in 3 in); still air 81 15 % C/W
R
th(j-c)
thermal resistance from
junction to case
18 15 % C/W
WLCSP49 Package
R
th(j-a)
thermal resistance from
junction to ambient
JEDEC (4.5 in 4 in); still air 41 15 % C/W
R
th(j-c)
thermal resistance from
junction to case
0.3 15 % C/W
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