Textron Cessna 182S - Page 140

CESSNA
AIRCRAFT COMPANY
MODEL 182/T182
WIRING
DIAGRAM
MANUAL
B. Identify component
by reference designation and note its polarity
and pin orientation before removing
it from board.
NOTE: Time
between removal of
old component, cleaning
and soldering of
new component must
be kept to a minimum to prevent the
formation of metallic oxides on surfaces
to be soldered.
C. Two
methods for component
solder removal
are provided. Select
a method based on
equipment
availability.
(1)
Solder Extraction
with Continuous Vacuum.
(a) Select solder
extraction tool and tip on the
following criteria:
1 Extraction
Tool: Furnish adequate
heat to melt solder.
2 Tip I.D.: Minimum
inside diameter
that will fit over
lead or pin while allowing
sufficient
clearance around
the lead to permit solder
and air to pass through it.
3
Tip O.D.: Maximum outside diameter
should not cover the pad completely
nor touch
the
circuit board
base material.
(b) Set tip temperature
so as to melt solder in two
to three seconds.
(c) Lightly place solder tip over lead and onto solder connection perpendicular to board or
terminal.
(d) Once solder begins
to melt, use the tip to move the lead
until it swings freely, indicating full
solder melt.
(e)
Continuing to move
the lead, start vacuum
to remove solder
and cool the solder
joint. Apply
vacuum for one to two seconds.
(f) Remove
the
tip then
turn off vacuum.
(2) Solder Removal with Solder Wick.
(a) If
component has exposed
leads, cut leads
and discard damaged
components and
leads.
(b) Place a soldering iron equipped
with the appropriate tip where lead end
passes through
board.
(c)
Heat the
solder carefully.
(d) Once solder has softened, extract lead end from board from the side opposite component.
(e) Place solder wick over location of extracted component lead and heat solder wick with
soldering iron.
(f) Wick remaining solder from lead connection hole in board.
(g) Repeat this procedure for both sides of lead connection hole.
D.
Wire Lead
Solder Removal.
(1) Using a
soldering iron equipped with the appropriate
tip, carefully heat the lead to be removed
until the solder melts.
(2) Carefully remove the lead wire so
as to alter the shape of the connecting bend
as little as possible.
(3) Place solder
wick over
location of extracted
wire
lead. Heat solder
wick with
soldering iron
to
remove
remaining
solder from wire
lead.
20-10-03 Page 206
© Cessna
Aircraft Company
Mar
1/2004