Mindray DC-8 - Power and the Supported Functions Distribution

Product Principle 4-23
4.8.5 Power and the Supported Functions Distribution
Back-end
power
board
Front-end
power
auxiliary &
main
board
Back-end motherboard
Front-end
analog motherboard
OVP/OCP/OTP
AC/DC
Communication motherboard
Digital board
CPU
module
Power
module
D+12V
D+5V
D+3.3V
D-5V
D+5VSTB
OCP
Power
amplificat
ion
D12V
DVD-
R/W
HDD
Fan
Control
panel
Touch
screen monitor
Gel
heater
ECG4D&TEE
Temperature fuse
D+5V
D-5V
D+3.3V
D-12V
D+5VSTB
D+12V
D+5V
A+12V
FED+12V
A+12V
A+5V7
A+4V
A+3V3
A+2V5
A+1V8
A-12V
A-5V7
A+19V
A-+HV
A-+PHV
Transmission board
A+12V
A+4V
A+3V3 A+1V8
A-12V
A-+PHV
Receiving board
A+12V A+5V7
A-+HV
A+4V
A+3V3 A+2V5
A+1V8
A-5V7
Probe board
CW board
A+12V A+5V7
A+4
V
A+3V3 A+2V5
A+1V8
A-12V
A-5V7
A+19V
DSP
board
FED+12V
A+12V
A+12V
A+5V7
A+4V
A+3V3
A+2V5
A+1V8
A-12V
A-5V7
A+19V
A-+HV
A-+PHV
FED+12V
A+12V
A-+HV
A+5V7
D+12V TO
communication
motherboard
D+5V TO
communication
motherboard
D+12V
D+5V
Represent the fuse
OVP Represent over-voltage protect
OCP Represent over-current protect
OTP Represent over-temperature protect
External AC input
Connecting
board
IOBOX board
IO+5V
IO+3V3
To communication motherboard
To communication motherboard
D+12V
IO+5V
IO+3V3
D-12V
D+3.3V
D+12V
Fig 4-28 Schematic Diagram System Power Distribution