Mirae Mx400 - Page 114

4-40 Mx-Series Operation Manual
QFP 160
27.2mm x 27.2mm x
2.5mm
QFP 208
30.6mm x 30.6mm x
3.6mm
<Table 4-11 Nozzles applicable by component (5)>
Component Information
Nozzles
Component
Type
Component
Code
Dimension
A
B-1
C
D
E
P2-1
H-
4C
PBGA IC
PBGA 119
14.0mm x 22.0mm x
2.3mm
PBGA 169
23.0mm x 23.0mm x
2.3mm
PBGA 208
23.0mm x 23.0mm x
2.3mm
PBGA 225
27.0mm x 27.0mm x
2.3mm
PBGA 304
31.0mm x 31.0mm x
2.3mm
PBGA 420
35.0mm x 35.0mm x
2.3mm
Diodes
SOD 80
3.7mm x 1.7mm x
1.4mm
SOD 123
2.9mm x 3.9mm x
1.4mm
SOD 323
1.9mm x 2.7mm x
1.2mm
CEREC-X
4.2mm x 4.2mm x
1.6mm
CEREC-
X(S)
4.2mm x 2.6mm x
1.6mm
CEREC-Xf
4.2mm x 4.2mm x
1.5mm
Control System
Main Board
- A VME Bus Master board that control bus and provides user interface
through TCP/IP, serial communication with PC.
MRIL
- An illumination control board that controls illumination of the module
cameras and offset cameras through the VME bus