Motorola R-2001D - Page 6

9. When replacing a CMOS integrated circuit
device, leave the device in its metal rail container or con-
ductive foam until it is to be inserted into the printed cir-
cuit module.
10. All low impedance test equipment (such as
pulse generators, etc.) should be connected to CMOS
vi
device inputs after power is applied to the CMOS cir-
cuitry. Similarly, such low impedance equipment should
be disconnected before power is turned off.
11. Replacement modules shipped separately from
the factory will be packaged in a conductive material.
Any modules being transported from One area to
another should be wrapped in a simlar material
(aluminum foil may be used). NEVER USE NON-
CONDUCTIVE MATERIAL for packaging these
modules.
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