Quectel 5G Module Series Hardware Design

5G Module Series
RM500Q-AE&RM502Q-AE Hardware Design
RM500Q-AE&RM502Q-AE_Hardware_Design 9 / 86
Table 42: (U)SIM 1.8V I/O Requirements .................................................................................................. 76
Table 43: (U)SIM 3.0V I/O Requirements .................................................................................................. 76
Table 44: Electrostatic Discharge Characteristics (Temperature: 25 ºC , Humidity: 40 %) ....................... 76
Table 45: Absolute Maximum Ratings ....................................................................................................... 78
Table 46: Operating and Storage Temperatures ....................................................................................... 79
Table 47: Related Documents .................................................................................................................... 84
Table 48: Terms and Abbreviations ........................................................................................................... 84

Quectel 5G Module Series Specifications

General

Brand	Quectel
Model	5G Module Series
Category	Motherboard
Language	English