Quectel 5G Module Series Hardware Design

5G Module Series
RM500Q-AE&RM502Q-AE Hardware Design
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1 Introduction
1.1. Introduction
The hardware design defines RM500Q-AE and RM502Q-AE and describes the air and hardware
interfaces which are connected to customers’ applications.
This document helps you quickly understand the interface specifications, electrical and mechanical
details, as well as other related information of RM500Q-AE and RM502Q-AE. To facilitate its application
in different fields, reference design is also provided for reference. Associated with application notes and
user guides, customers can use the module to design and set up mobile applications easily.
This document is applicable to RM500Q-AE and RM502Q-AE modules.
1.2. Reference Standard
The module complies with the following standards:
⚫ PCI Express M.2 Specification Revision 3.0, Version 1.2
⚫ PCI Express Base Specification Revision 3.0
⚫ Universal Serial Bus Specification, Revision 3.1
⚫ ISO/IEC 7816-3
⚫ MIPI Alliance Specification for RF Front-End Control Interface version 2.0
⚫ 3GPP TS 27.007 and 3GPP TS 27.005

Quectel 5G Module Series Specifications

General

Brand	Quectel
Model	5G Module Series
Category	Motherboard
Language	English