Quectel 5G Module Series - Thermal Dissipation

5G Module Series
RM500Q-AE&RM502Q-AE Hardware Design
RM500Q-AE&RM502Q-AE_Hardware_Design 77 / 86
6.5. Thermal Dissipation
RM500Q-AE and RM502Q-AE are designed to work in an extended temperature range. To achieve a
maximum performance while working under extended temperatures or extreme conditions (such as with
maximum power or data rate) for a long time, it is strongly recommended to add a thermal pad or other
thermally conductive compounds between the module and the main PCB for thermal dissipation.
The thermal dissipation area on the bottom (i.e. the area for adding thermal pad) is shown as below, and
thermal paste are also added on the BB, MCP, PMU, WTR, PA-1, PA-2 chips inside the module. The
dimensions are measured in mm.
Figure 37: Thermal Dissipation Area Inside and on Bottom Side of the Module
Other Interfaces
±0.5
±1
kV