Quectel 5G Module Series Hardware Design

5G Module Series
RM500Q-AE&RM502Q-AE Hardware Design
RM500Q-AE&RM502Q-AE_Hardware_Design 82 / 86
7.3. M.2 Connector
The module adopts a standard PCI Express M.2 connector which compiles with the directives and
standards listed in the PCI Express M.2 Specification.
7.4. Packaging
The modules are packaged in trays. The following figure shows the tray size.
Figure 41: Tray Size (Unit: mm)
Each tray contains 10 modules. The smallest package contains 100 modules. Tray packaging procedures
are as below.
1. Use 10 trays to package 100 modules at a time (tray size: 247 mm × 172 mm).
2. Place an empty tray on the top of the 10-tray stack.
3. Fix the stack with masking tape in “#” shape as shown in the following figure.
4. Pack the stack with conductive bag, and then fix the bag with masking tape.
5. Place the list of IMEI No. into a small carton.
6. Seal the carton and then label the seal with sealing sticker (small carton size: 250 mm × 175 mm ×
128 mm).

Quectel 5G Module Series Specifications

General

Brand	Quectel
Model	5G Module Series
Category	Motherboard
Language	English