112 Rockwell Automation Publication ICSTT-RM447M-EN-P - July 2019
Chapter 7 Module Overview and Specifications
T9110 Processor Module Specification
Table 23 - Processor Module Specification
Attribute Value
Functional Characteristics
Degradation 1oo1D, 1oo2D and 2oo3D
(1)
(1) When a controller's processor modules have degraded to 1oo1D, the system must be restored to at least 1oo2D by replacing the
faulty processor module(s) within the MTTR assumed in the PFD calculations; also, unless compensating measures are defined in
the Safety Requirements Specification (SRS) and documented in operating procedures, the application program must be
designed to shut down safety instrumented functions if a module failure due to dangerous fault has not been replaced within
the MTTR.
Processor clock 400 MHz
Memory
Boot flash 512 kB
SRAM 512 kB
Bulk flash 64 MB
SDRAM 32 MB
Sequence of events (for internal variables)
Event resolution 1 ms
Time-stamp accuracy Application Scan
Self Test Interval < 5.5 hours
Performance Characteristics
Safety Integrity Level (SIL) 1 processor: non-safety applications up to SIL 1
2 Processors: up to SIL 3 safety applications
3 Processors: up to SIL 3 fault tolerant and TMR safety
applications
I/O Modules supported 48
Electrical Characteristics
Module supply voltage
Voltage Redundant + 24 Vdc nominal; 18-32 Vdc range
Module supply power dissipation 8 W (27.3 BTU/h)
Typical Surface Temperature of an Operating Module 43 °C ± 5 °C
Mechanical Specification
Dimensions (height × width × depth) 166 mm × 42 mm × 118 mm
(6-½ in. × 1-5/8 in. × 4-5/8 in.)
Weight 430 g (15 oz.)
Casing Plastic, non-flammable
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