Digi XBee SX 868 - Recommended Solder Reflow Cycle

PCB design and manufacturing Recommended solder reflow cycle
XBee® SX 868 RF Module User Guide
210
Number Description
1
XBee pin 36
2 50 Ω microstrip trace
3 Back off ground fill at least twice the distance between layers 1 and 2
4 RF connector
5 Stitch vias near the edges of the ground plane
6 Pour a solid ground plane under the RF trace on the reference layer
Implementing these design suggestions helps ensure that the RFpad device performs to
specifications.
Recommended solder reflow cycle
The following table provides the recommended solder reflow cycle. The table shows the temperature
setting and the time to reach the temperature; it does not show the cooling cycle.