Safety Bus Manual — P/N LS10177-000HI-E:B 02/21/2019 12
System Architecture Introduction
2.2 System Architecture
The system consists of one or two control boards and a varying number (1 to 64) of I/O modules.
The modules are connected to each other by a ring-type connection that is able to support a single
failure (short or open circuit).
2.3 Monitoring for Integrity
The devices are completely monitored by the control boards to detect any module or ring failures.
The I/O modules send the information regarding the status of the channels to the control boards.
The messages sent by the modules have high priority to guarantee immediate signaling of an alarm.
Both the control boards and the modules are equipped with two independent communication links:
link 1 is connected to the downstream module; link 2 is connected to the upstream module. Both
links are galvanically insulated from the power supply voltage, making it possible to power the
modules using local power supplies.
Message Condition
Dispersion failure Local power supply leakage to ground detected by an SB-SIM-GM module
PSU1 failure Local power supply primary voltage failure
PSU2 failure Local power supply secondary voltage failure
Stand-alone SB-ECM module reconnected on the ring after performing a back-up
25V failure Module power supply voltage out of range
Temperature failure Module internal temperature out of range
Internal failure Module internal failure
Firmware not compatible Firmware version not compatible with the control board
Module not compatible Module not compatible (Brand)
Module removed Module removed from ring, faulty or not powered
Multiple address One or more modules along the ring have the same address
Log on fault Discrepancy between the modules programmed in the panel and those detected
by the control board
Communication ring failure Communication ring segment failure (open or short circuit)
Table 2.2 Module Failure Message
Figure 2.2 System Architecture with Mono Configuration
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