8. Thoroughly clean the thermal material from the surfaces of the fan/heat sink assembly and the system
board components each time the fan/heat sink assembly is removed. Replacement thermal material is
included with the fan/heat sink assembly and system board spare part kits. The following illustrations
show the replacement thermal material locations.
Thermal paste is used on the processor (1) and on the fan/heat sink assembly area (2) that services the
processor. Thermal pads are used on the VGA chip and other system board components (3) and the fan/
heat sink assembly areas (4) that service them.
Reverse this procedure to install the fan/heat sink assembly.
82 Chapter 6 Removal and replacement procedures for authorized service provider parts ENWW
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