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IBM X3850 X6 User Manual

IBM X3850 X6
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Chapter 2. Technology 35
When this threshold is reached, the content is copied to its spare rank. The failed rank is then
taken offline, and the spare counterpart is activated for use.
In rank sparing mode, one rank per memory channel is configured as a spare. The spare rank
must have identical or larger memory capacity than all the other ranks (sparing source ranks)
on the same channel.
For example, If dual-rank DIMMs are installed, all of the same capacity, then there are 6 ranks
total for each memory channel (three DIMMs per channel). This means that 1 of the 6 ranks
are reserved and 5 of the 6 are usable for operating system use.
Memory sparing is independent of the operating system. There is a slight memory
performance trade-off when memory sparing is enabled.
The rank sparing feature can be used in addition to performance or RAS modes:
򐂰 When Performance mode is used, rank sparing duplicates data between memory modules
of same channel of one memory buffer. In the event of an imminent failure (red X in
Figure 2-26), that rank is taken offline and the data is copied to the spare rank.
򐂰 When RAS (Lockstep) mode is used, rank sparing duplicates data between memory
channels of one memory buffer. In the event of an imminent failure (red X in Figure 2-26),
that rank is taken offline and the data is copied to the spare rank. In addition, the partner
rank on the other channel connected to the same memory buffer is also copied over.
Figure 2-26 shows the rank sparing usage in conjunction with Performance mode (left) and
RAS mode (right).
Figure 2-26 Rank sparing: Performance mode (left) and RAS mode (right)
Intel Xeon processor
DIMM
Memory
controller
DIMM
DIMM
Memory
controller
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
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DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
Memory
buffer
Memory
buffer
Memory
buffer
Memory
buffer
Intel Xeon processor
DIMM
Memory
controller
DIMM
DIMM
Memory
controller
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
DIMM
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DIMM
DIMM
DIMM
DIMM
DIMM
Memory
buffer
Memory
buffer
Memory
buffer
Memory
buffer
Lockstep
channel
Memory performance mode
+ rank sparing
Memory RAS mode
+ rank sparing
Spare ranks (1 for each of the 8 channels)
(assuming dual-rank DIMMs)
Forced
failover
Failover
Failover

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IBM X3850 X6 Specifications

General IconGeneral
ChipsetIntel C602J
Network ControllerIntegrated quad-port Gigabit Ethernet
ProcessorUp to four Intel Xeon E7-4800 v2 series processors or Intel Xeon E7-8800 v2 series processors
MemoryUp to 6 TB of DDR3 ECC Registered DIMMs (RDIMMs) or Load-Reduced DIMMs (LRDIMMs)
Form Factor4U rack server
StorageUp to 24x 2.5" hot-swap SAS/SATA HDDs or SSDs
Expansion SlotsUp to 11 PCIe 3.0 slots
Power SupplyUp to four 1400W or 900W hot-swap power supplies
Memory TypeDDR3 RDIMM/LRDIMM
Storage ControllerServeRAID M5210 SAS/SATA controller
RAID SupportRAID 0, 1, 5, 6, 10, 50, 60
Operating System SupportWindows Server, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, VMware

Summary

Chapter 1. Introduction

1.1 Target workloads

Overview of workloads supported by IBM X6 servers, focusing on databases, analytics, and enterprise applications.

1.2 Key features

Highlights the advantages of IBM X6 server technology including performance, agility, and resilience.

Chapter 2. Technology

2.1 Modular design

Explains the modular 'bookshelf' design of X6 servers, including Compute, Storage, and I/O Books.

2.2 System architecture

Details the overall architecture of x3850 X6 and x3950 X6 servers, including processor interconnects.

2.3 Processors

Discusses the Intel Xeon E7-4800/8800 v2 processors and their features.

2.4 Memory

Covers DDR3 memory options, modes, mirroring, sparing, and Chipkill.

2.8 Integrated Management Module

Details the IMM2 service processor for remote server management and monitoring.

Chapter 3. Product information

3.1 Product features

Describes the key features and capabilities of IBM X6 servers.

3.2 Specifications

Lists the standard specifications for x3850 X6 and x3950 X6 servers.

3.6 Compute Book

Details the design and components of the Compute Book, the core modular element.

3.7 Processor options

Lists available Intel Xeon processor options for X6 servers.

Chapter 4. Infrastructure planning

4.1 Physical and electrical specifications

Lists physical, electrical, and environmental specifications for X6 servers.

4.5 Power advice

Provides considerations for power subsystem planning and distribution.

Chapter 5. Preparing the hardware

5.1 Configuring the IMM2 settings

Guides on configuring IMM2 settings for server management and troubleshooting.

5.2 UEFI settings for performance

Details UEFI settings for tuning system performance and operating modes.

5.5 Hot-swap procedures

Explains how to hot-swap components like power supplies and I/O Books.

5.7 Updating firmware

Guides on updating system firmware using UpdateXpress, BoMC, and IMM.

5.8 Troubleshooting

Overview of tools and considerations for problem resolution and extended outages.

Chapter 6. Operating system installation

6.1 Installing without a local optical drive

Explains methods for OS installation using IMM, USB port, or PXE.

Chapter 7. Management

7.2 Integrated Management Module II (IMM2)

Explains the features and configuration of the IMM2 for server management.

7.3 Remote control

Details how to use the IMM2 remote control feature for server access.

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