Thermal Considerations CP308
Page 6 - 6 ID 1027-4487, Rev. 3.0
P R E L I M I N A R Y
6.3 Chipset Thermal Monitor
The Intel® GS45 GMCH includes the following temperature sensors:
• Two internal (on-die) thermal sensors for thermal management
• Two external thermal sensor notification inputs, which can regulate memory accesses
The maximum die temperature for the Intel® GS45 GMCH is 100°C.
6.3.1 Internal Thermal Sensors
The two on-die thermal sensors for thermal management may be programmed to cause hard-
ware throttling and/or software interrupts. The internal thermal sensors report the following six
trip points: Aux0, Aux1, Aux2, Aux3, Hot and Catastrophic trip points.
6.3.2 External Thermal Sensors
On the CP308 one thermal sensor notification input (PM_EXT_TS#_1) of the GS45 GMCH is
connected to the "Event" defined pin of the DDR3 SODIMM socket. Thus, a DDR3 SODIMM
module with onboard thermal sensor can indicate an overtemperature event to the GS45
GMCH.
The other thermal sensor notification input (PM_EXT_TS#_0) of the GS45 GMCH is connected
to the onboard FPGA logic and reserved for future use.
6.3.3 Catastrophic Trip Point Thermtrip
Assertion of the GS45 GMCH Thermal Trip (THERMTRIP#) indicates that its junction temper-
ature has reached a level beyond which damage may occur.
Therefore, the GS45 GMCH will stop all executions when the junction temperature exceeds ap-
proximately 130°C. Once activated, the event remains latched until the CP308 undergoes a
power-on restart (all power off and then on again).
Note ...
When the TH LED on the front panel is blinking after a successful boot-up, it
indicates that the processor die temperature is above 125°C or the GS45
GMCH die temperature is above 130°C.
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