The component size (Y-length) defined
in the component DB is different from
the chip size inspected from vision.
Check that the size is exactly
entered in the component DB and
that the component is not picked up
vertically. Check whether the
tolerance for chip size inspection is
too small (This does not concern the
centering option that does not apply
tolerance.). If components are
frequently picked up vertically, check
and adjust component feeding from
the feeder, picking position, picking
height, etc.
Angle (R) limit
exceeded
(+, -)
The angle detected in component
inspection is too large. Check whether
the nozzle size is too small compared to
the components. Check and adjust
component feeding from the feeder,
picking position, picking height, etc.
X offset limit
exceeded
(+, -)
This error occurs when the X offset
detected in component inspection is too
large. Set the component picking
position to the center of component.
Y offset limit
exceeded (+,-)
This error occurs when the Y offset
detected in component inspection is too
large. Set the component picking
position to the center of component.
An overturned register (R) chip was
picked up. This assumes that the bottom
of the chip is completely white or that it
reflects onto the lead. If the lower
surface is partly dark, apply other DB
information such as capacitor (C).
Edge angle of the
detected square is
distorted.
Check illumination, contamination of
component and background and
component DB information and retry
inspection.
Lead inspection fail
(Up)
Check illumination, contamination of
component and background and
component DB information and retry
inspection.
Lead count is too
low. (Up)
Check the DB information and the status
of component leads.
Lead count is too
high. (Up)
Check the DB information and the status
of component leads.