72 Rockwell Automation Publication 2198-UM005C-EN-P - February 2022
Chapter 5 Connect the Kinetix 5300 Drive System
Ground Multiple Subpanels
In this figure, the chassis ground is extended to multiple subpanels.
Figure 37 - Subpanels Connected to a Single Ground Point
High-frequency (HF) bonding is not illustrated. For HF bonding information,
refer to HF Bond for Multiple Subpanels
on page 36.
Follow NEC and applicable
local codes.
Bonded Ground Bus
Ground Grid or Power
Distribution Ground
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