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TMS570LS0714
SPNS226E –JUNE 2013–REVISED NOVEMBER 2016
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Table of Contents Copyright © 2013–2016, Texas Instruments Incorporated
Table of Contents
1 Device Overview ......................................... 1
1.1 Features .............................................. 1
1.2 Applications........................................... 2
1.3 Description............................................ 3
1.4 Functional Block Diagram ............................ 5
2 Revision History ......................................... 7
3 Device Comparison ..................................... 8
3.1 Related Products ..................................... 8
4 Terminal Configuration and Functions.............. 9
4.1 Pin Diagrams ......................................... 9
4.2 Signal Descriptions ................................. 11
4.3 Pin Multiplexing...................................... 29
4.4 Buffer Type.......................................... 35
5 Specifications .......................................... 36
5.1 Absolute Maximum Ratings......................... 36
5.2 ESD Ratings ........................................ 36
5.3 Power-On Hours (POH)............................. 36
5.4 Recommended Operating Conditions............... 37
5.5 Input/Output Electrical Characteristics Over
Recommended Operating Conditions............... 38
5.6 Power Consumption Over Recommended
Operating Conditions................................ 39
5.7 Thermal Resistance Characteristics ................ 40
5.8 Timing and Switching Characteristics ............... 41
6 System Information and Electrical
Specifications........................................... 43
6.1 Device Power Domains ............................. 43
6.2 Voltage Monitor Characteristics ..................... 43
6.3 Power Sequencing and Power-On Reset ........... 44
6.4 Warm Reset (nRST)................................. 46
6.5 ARM Cortex-R4F CPU Information ................. 47
6.6 Clocks ............................................... 51
6.7 Clock Monitoring .................................... 58
6.8 Glitch Filters......................................... 60
6.9 Device Memory Map ................................ 61
6.10 Flash Memory ....................................... 66
6.11 Tightly Coupled RAM Interface Module ............. 69
6.12 Parity Protection for Accesses to Peripheral RAMs 69
6.13 On-Chip SRAM Initialization and Testing ........... 71
6.14 Vectored Interrupt Manager ......................... 73
6.15 DMA Controller ...................................... 76
6.16 Real-Time Interrupt Module ......................... 78
6.17 Error Signaling Module .............................. 80
6.18 Reset/Abort/Error Sources .......................... 84
6.19 Digital Windowed Watchdog ........................ 87
6.20 Debug Subsystem................................... 88
7 Peripheral Information and Electrical
Specifications........................................... 93
7.1 I/O Timings ......................................... 93
7.2 Enhanced PWM Modules (ePWM).................. 96
7.3 Enhanced Capture Modules (eCAP)............... 102
7.4 Enhanced Quadrature Encoder (eQEP) ........... 105
7.5 12-Bit Multibuffered Analog-to-Digital Converter
(MibADC)........................................... 108
7.6 General-Purpose Input/Output..................... 121
7.7 Enhanced High-End Timer (N2HET) .............. 122
7.8 Controller Area Network (DCAN) .................. 126
7.9 Local Interconnect Network Interface (LIN)........ 127
7.10 Serial Communication Interface (SCI) ............. 128
7.11 Inter-Integrated Circuit (I2C) Module .............. 129
7.12 Multibuffered / Standard Serial Peripheral
Interface............................................ 132
8 Applications, Implementation, and Layout ...... 144
8.1 TI Designs or Reference Designs ................. 144
9 Device and Documentation Support.............. 145
9.1 Getting Started and Next Steps ................... 145
9.2 Device and Development-Support Tool
Nomenclature ...................................... 145
9.3 Tools and Software ................................ 147
9.4 Documentation Support............................ 149
9.5 Community Resources............................. 149
9.6 Trademarks ........................................ 149
9.7 Electrostatic Discharge Caution ................... 150
9.8 Glossary............................................ 150
9.9 Device Identification................................ 151
9.10 Module Certifications............................... 152
10 Mechanical Packaging and Orderable
Information............................................. 157
10.1 Packaging Information ............................. 157
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